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 Microprocessor-compatible 8-Bit ADC
TABLE 1. PIN DESCRIPTION
PIN 1 2 3 4 5 6 7 SYMBOL VIN DB0 DB1 DB2 DB3 WR/RDY Mode DESCRIPTION Analog Input Range: VREF(-) to VREF(+). Data Output. Three State Output, bit 0 (LSB) Data Output. Three State Output, bit 1 Data Output. Three State Output, bit 2 Data Output. Three State Output, bit 3 WRITE control input/READY status output. Mode Selection Input. It determines whether the device operates in the WR-RD or RD mode. It is internally tied to GND through a 50 A current source. READ Input. RD must be low to access data from the part. INTERUPT Output. INT going low indicates that the conversion is complete INT returns high on rising the edge of RD or CS. Ground Lower limit of reference span. Range: GND < VREF(-) < VREF(+) Upper limit of reference span. Range: GND < VREF(-) < VREF(+) < VDD Chip Select Input. CS, the decoded device address, must be low for RD or WR to be recognized by the converter. Data Output. Three State Output, bit 4 Data Output. Three State Output, bit 5 Data Output. Three State Output, bit 6 Data Output. Three State Output, bit 7 (MSB) Overflow Output. If the analog input is higher than (VREF(+) - 1/2LSB), OFL will be low at the end of conversion. It is a non three state output which can be used to cascade 2 or more devices to increase resolution. No Connection. Power supply voltage, +5V
7820
8 9 10 11 12 13 14 15 16 17 18
RD INT GND VREFVREF+ CS DB4 DB5 DB6 DB7 OFL
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19 20
NC VDD
TABLE 2. 7820 ABSOLUTE MAXIMUM RATINGS1
PARAMETER VDD to GND Digital Input Voltage to GND (Pins 6-80, 13) Digital Output Voltage to GND (Pins 2-5, 9, 14-18) VREF (+) to GND VREF (-) to GND MIN -0 -0.3 0.3 0 VSS -0.3 MAX 7.0 VDD +0.3 VDD +0.3 VDD +0.3 VREF (+) UNIT V V V V V
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
TABLE 2. 7820 ABSOLUTE MAXIMUM RATINGS1
PARAMETER VIN to GND Operating Temperature Storage Temperature Range Power Dissipation to 75C Derates above +75C MIN -0.3 -55 -65 --MAX VDD +0.3 125 150 450 6 UNIT V C C mW
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mW/C
1. CAUTION: ESD (electrostatic discharge) sensitive device. The digital control inputs are diode protected; however, permanent damage may occur on unconnected devices subject to high energy electrostatic fields. Unused devices must be stored in conductive foam or shunts. The protective foam should be discharged to the destination socket before devices are inserted.
TABLE 3. 7820 DC ELECTRICAL CHARACTERISTICS
(VDD = +5V; VREF(+) = +5V; VREF(-) = GND = 0V, UNLESS OTHERWISE SPECIFIED) (RD MODE (PIN 7 = 0V)) (TA = -55 TO 125 C UNLESS OTHERWISE SPECIFIED) PARAMETER Accuracy Resolution Total Unadjusted Error1 Minimum Resolution for which No Missing Codes are Guaranteed Reference Input Input Resisitance VREF (+) Input Voltage Range VREF (-) Input Voltage Range Analog Input Input Voltage Range Input Leakage Current Input Capacitance2 Logic Inputs CS, WR, RD VINH VINH IINH(CS, RD) IINH(WR) IINL(WR) Input Capacitance2 ------1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 2.4 ----------5 -0.8 1 3 -1 8 V V A A A pF ---1, 2, 3 1, 2, 3 1, 2, 3 VREF(-) ----45 VREF(+) 3 -V A pF ---1, 2, 3 1, 2, 3 1, 2, 3 1.0 VREF(-) GND ---4.0 VDD VREF(+) k V V ---8 ------1.0 8 Bits LSB Bits TEST CONDITIONS SUBGROUPS MIN TYP MAX UNIT
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All data sheets are subject to change without notice
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
TABLE 3. 7820 DC ELECTRICAL CHARACTERISTICS
(VDD = +5V; VREF(+) = +5V; VREF(-) = GND = 0V, UNLESS OTHERWISE SPECIFIED) (RD MODE (PIN 7 = 0V)) (TA = -55 TO 125 C UNLESS OTHERWISE SPECIFIED) PARAMETER Mode VINH IINH IINL Input Capacitance2 Logic Outputs DB0-DB7, OFL, INT VOH VOL IOUT(DB0-DB7) Output Capacitance2 RDY VOL IOUT Output Capacitance2 Slew Rate, Tracking2 Power Supply VDD 5% for specified performance CS = RD = OV -VDD = 5V 5% 1, 2, 3 --5 ISINK = 2.6mA Floating State Leakage --1, 2, 3 1, 2, 3 4, 5, 6 1, 2, 3 ------5 0.2 0.4 3 8 0.1 ISOURCE = 360 A ISINK = 1.6 mA Floating State Leakage -1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 4 ------5 -0.4 3 8 ----1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 3.5 ------5 -200 -1 8 TEST CONDITIONS SUBGROUPS MIN TYP MAX
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UNIT
V A A pF
V V A
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pF V V pF V/ s V
IDD Power Dissipation Power Supply Sensitivity
1, 2, 3 1, 2, 3 1, 2, 3
----
-40 1/16
20 -1/4
mA mW LSB
1. Total unadjusted error includes offset, full scale and linearity error. 2. Guarenteed by design.
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All data sheets are subject to change without notice
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
TABLE 4. 7820 AC ELECTRICAL CHARACTERISTICS1
(VDD = +5V; VREF(+) = +5V; VREF(-) = GND = 0V, UNLESS OTHERWISE SPECIFIED) (RD MODE (PIN 7 = 0V)) (TA = -55 TO 125 C UNLESS OTHERWISE SPECIFIED) PARAMETER CS to RD/WR Setup Time CS to RD/WR Hold Time CS to Delay Time (Pull-up Resistor = 5k Conversion Time (RD Mode) Data Access Time (RD Mode) RD to INT Delay (RD Mode) Data Hold Time Delay Time Between Conversions Write Pulse Width Delay Time Between WR and RD Pulses Data Access Time (WR-RD Mode) RD to INT Delay WR to INT Delay Data Access Time (WR-RD Mode) WR to INT Delay (Stand-Alone Operation) Data Access Time After INT (Stand-Alone Operation SUBGROUPS 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 9, 10, 11 SYMBOL tCSS tCSH tRDY tCRD tACCD tINTH tDH tp tWR tRD tACC1 tR1 tINTL tACC2 tIHWR tID MIN 0 0 -----600 600 -700 ------MAX --100 2.5 tCRD + 50 225 100 --50 -250 225 1700 110 150 75
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UNIT ns ns ns s ns ns ns ns ns s ns ns ns ns ns ns ns
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1. Sample tested at 25C to ensure compliance. Only on process design change.
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
FIGURE 1. LOAD CIRCUITS FOR DATA ACCESS TIME TEST
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Memory
FIGURE 2. LOAD CIRCUITS FOR DATA HOLD TIME RESET
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
FIGURE 3. LOAD CIRCUIT FOR ACCESS TIME
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FIGURE 4. LOAD CIRCUIT FOR OUTPUT FLOAT DELAY
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
FIGURE 5. ACCURACY VS. TWR
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FIGURE 6. ACCURACY VS. TRD
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
7820
FIGURE 7. ACCURACY VS. TSP
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FIGURE 8. ACCURACY VS. TREF [VREF = VREF(+) - VREF(-)]
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
FIGURE 9. SIGNAL-NOISE RATIO VS. INPUT FREQUENCY
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FIGURE 10. TINTL INTERNAL TIME DELAY VS. TEMPERATURE
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
FIGURE 11. OUTPUT CURRENT VS. TEMPERATURE
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FIGURE 12. OPERATING SEQUENCE (WR-RD MODE)
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
FIGURE 13. RD MODE
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FIGURE 14. WR-RD MODE (TRD>TINTL)
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
FIGURE 15. WR-RD MODE (TRD7820
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FIGURE 16. WR-RD MODE STAND-ALONE OPERATION (CS=RD=0)
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All data sheets are subject to change without notice
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
FIGURE 17. POWER SUPPLY AS REFERENCE
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FIGURE 18. INPUT NOT REFERENCED TO GND
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
7820
FIGURE 19. EQUIVALENT INPUT CIRCUIT
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FIGURE 20. RC NETWORK MODEL
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
7820
Memory
20 PIN RAD-PAK(R) DUAL IN LINE PACKAGE
SYMBOL MIN A b b2 c D E eA eA/2 e L Q S1 S2 N 0.135 0.015 0.005 0.005 -0.014 0.045 0.008 -0.220 DIMENSION NOM 0.202 0.018 0.050 0.010 1.000 0.295 0.300 BSC 0.150 BSC 0.100 BSC 0.145 0.045 0.025 -20 0.155 0.070 --MAX 0.230 0.026 0.065 0.018 1.060 0.310
Note: All dimensions in inches
09.09.03 Rev 3
All data sheets are subject to change without notice
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
Important Notice:
7820
These data sheets are created using the chip manufacturer's published specifications. Maxwell Technologies verifies functionality by testing key parameters either by 100% testing, sample testing or characterization. The specifications presented within these data sheets represent the latest and most accurate information available to date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no responsibility for the use of this information. Maxwell Technologies' products are not authorized for use as critical components in life support devices or systems without express written approval from Maxwell Technologies. Any claim against Maxwell Technologies must be made within 90 days from the date of shipment from Maxwell Technologies. Maxwell Technologies' liability shall be limited to replacement of defective parts.
Memory
09.09.03 Rev 3
All data sheets are subject to change without notice
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(c)2003 Maxwell Technologies All rights reserved.
Microprocessor-compatible 8-Bit ADC
Product Ordering Options
Model Number 7820 RP D X Feature Option Details
7820
Screening Flow
Monolithic S = Maxwell Class S B = Maxwell Class B I = Industrial (testing @ -55C, +25C, +125C) E = Engineering (testing @ +25C)
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Package
D = Dual In-line Package (DIP)
Radiation Feature
RP = RAD-PAK(R) package
Base Product Nomenclature
Microprocessor-Compatible 8-Bit ADC
09.09.03 Rev 3
All data sheets are subject to change without notice
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(c)2003 Maxwell Technologies All rights reserved.


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